Diced Wafers
Silson supplies a range of plain silicon substrates, either as individually inspected and packaged frames or as pre-diced silicon wafers. These can either be blank uncoated silicon, silicon nitride coated silicon wafers or metal coated wafers, with gold being the most popular coating.
Diced wafers or chips are used as substrates for a wide range of applications including in biological and material sciences.
Standard designs include any combination of the following parameters:
| Wafer diameter: | 100 mm |
| Wafer thickness: | 200 µm 381 µm 525 µm |
| Frame size: | 4.0 x 4.0 mm 5.0 x 5.0 mm 7.5 x 7.5 mm 10.0 x 10.0 mm |
| Coating: | none (uncoated silicon) silicon nitride (standard is 100 nm SiRN) gold Au (with titanium Ti adhesion layer) other metal coatings available upon request (see our coated membranes page for details) |