E-beam Deposition

Silson offers an e-beam deposition service that we are able to cater to your specific requirements. We offer a wide range of coating thicknesses, with 1-500nm being typical, however we can coat with other thicknesses upon request.

We are able to accommodate both 4-inch and 6-inch wafers. In addition to coating our own membranes and wafers, we can also coat customer supplied wafers or substrates.

Our pricing model is tailored to a “per run” basis, and costs vary depending on the chosen material; please contact us with details of your requirements regarding coating material and thickness.

Silson offers a variety of different materials such as; aluminium, titanium, gold, platinum, silver, chrome, copper, nickel and zirconium.

Electron Beam Evaporation, also known as e-beam evaporation, is a powerful technique for physical vapor deposition. It enables the evaporation of materials that are challenging to achieve through standard resistive thermal methods, especially high-temperature metals and materials such as silicon oxide and other optical films.

The concept:

E-beam deposition utilizes a magnet to focus electrons into a beam directed towards a crucible containing the desired material for evaporation. The energy transferred initiates the evaporation process. Most metals, such as Aluminium, initially melt before evaporating, while ceramics sublimate. The resulting material vapours exit the crucible, coating the substrate.

Thank you to NuNano for this AFM image of one of our wafers coated with 50nm Au on 5nm Ti, with an RMS roughness measurement.