Wafer dicing

Silson has an in-house ADT 7900 dicing saw and has capability to dice 76.2 mm, 100 mm and 150 mm wafers to meet your requirements!

We are able to supply the diced wafers either ‘in tact’, still on dicing tape, packed in a wafer shipper, and you can peel off the chips as you need them. Alternatively we can package individual frames for you.

Standard wafers we dice are:

1. blank, uncoated silicon wafers

2. silicon nitride coated silicon wafers

3. metal coated wafers, with 10nm Ti + 100 nm Au being the most popular coating

Standard designs include any combination of the following parameters:

Wafer diameter:	76.2 mm 100 mm 150 mm
Wafer thickness:	200 µm 381 µm 525 µm
Frame size:	4.0 x 4.0 mm 5.0 x 5.0 mm 7.5 x 7.5 mm 10.0 x 10.0 mm
Coating:	none (uncoated silicon) silicon nitride (standard is 100 nm SiRN) gold Au (with titanium Ti adhesion layer) other metal coatings available upon request (see our coated membranes page for details)

We also have the capability to dice membrane wafers due to our saw having a submersion dicing option, which allows for precisely cut squares without the risk of breaking membranes during the process.

Don’t hesitate to get in touch with your dicing requirements!